YAMAHA 3D high-speed solder paste printing inspection machine YSi-SP
Date:2020-11-20    Hits:155
A "high-speed universal integrated mounting head" suitable for various inspections, achieving high-precision and high-speed inspections such as 3D+2D inspection and resolution switching functions. A detailed and rich M2M (Machine to Machine) solution with rich SPC functions can achieve various statistical processing options suitable for various products

Basic specifications

YSi SP


Object substrate size L510mm × W460mm~L50mm × W50mm (monorail model)


※ Non dual track model


Horizontal resolution (FOV size) 1) 25 μ M/12.5 μ M (approximately 50 × 50mm)


2) 20 μ M/10 μ M (approximately 40 × 40mm)


3) 15 μ M/7.5 μ M (approximately 30 × 30mm)


※ All are standard selection formulas


High resolution 1 µ m


Check the printing status of solder paste for the project (volume, height, area, position offset)


Power specification single-phase AC 200/208/220/230/240V ± 10% 50/60Hz


Air supply does not require air


External dimensions (excluding protrusions) L904 × W1080 × H1478mm


The main body weight is approximately 550kg


SURFACE MOUNT EQUIPMENT HYBRID MOUNTING EQUIPMENT SOLDER PASTE PRINTER YAMAHA DISPENSER AOI SPI 其他检查装置 REFLOW CLEANING EQUIPMENT INKJET PRINTER STORAGE SYSTEM PARTS SUPPORT SYSTEMS AND SOFTWARE

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